GeneQueryâ„¢ Human Skin Wound Healing qPCR Array Kit

ScienCell's GeneQuery™ Human Skin Wound Healing qPCR Array Kit (GQH-SWH) is designed to facilitate gene expression profiling of 88 key genes involved in the wound repair process. Wound healing is a complex process that includes many biological events, such as phagocytosis, angiogenesis, neocollagenesis, epithelialization, and collagen remodeling. It can be generally divided into 3 stages: 1) hemostasis and coagulation, 2) inflammation, and 3) proliferation and tissue remodeling. Brief examples of how included genes may be grouped according to their functions are shown below:

Wound healing stages -

• Hemostasis and coagulation: - IL1A, IL1B, IL6, TNF, FGF2, IGF1, TGFs, HIF1A
• Inflammation: - CXCL8, VEGFs, ELANE, CTSG, PRTN3, PLAU, TGFs, PDGFs, TNF, IFNG
• Proliferation and tissue remodeling: - EGF, FGF7, IGF1, IFNG, CSK, RAC1, RHOA, CDC42

• Extracellular Matrix components: - COL1A2, COL3A1, COL4A1, COL14A1
• Cellular adhesion: - CDH1, ITGAs, ITGBs, MMPs, F3, FGA, TIMP1, ACTA2, ACTC1, TAGLN
• Cytokines and chemokines: - CCL2, CXCL1, CXCL2, CXCL8, IL1A, IL1B, IL4, IL6
• Growth factors: - CSF2, CSF3, EGF, CTGF, FGFs, PDGFs, TGFs

GeneQuery™ qPCR array kits are qPCR ready in a 96-well plate format, with each well containing one primer set that can specifically recognize and efficiently amplify a target gene's cDNA. The carefully designed primers ensure that: (i) the optimal annealing temperature in qPCR analysis is 65°C (with 2 mM Mg^2+ , and no DMSO); (ii) the primer set recognizes all known transcript variants of target gene, unless otherwise indicated; and (iii) only one gene is amplified. Each primer set has been validated by qPCR with melt curve analysis, and gel electrophoresis.

This kit is designed to facilitate gene expression profiling of 88 key genes involved in the wound repair process. Wound healing is a complex process that includes many biological events, such as phagocytosis, angiogenesis, neocollagenesis, epithelialization, and collagen remodeling.